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Electronic Manufacturing Services (EMS)
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Electronic Manufacturing Services (EMS)
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Manufacturing Capabilities:

Providing complete electronic manufacturing solutions. Equipped with state-of-art fully automated SMT & PTH assembly lines.

         SMT Line including both Single and Double Sided

         Fine Pitch BGA’s( Micro BGA, FBGA, PBGA, Metal BGA etc..) & IC’s/ FPGA/ CPLD’s.

         Through Hole & SMT Mixed

         Multi Chip Modules

         Potting & Conformal Coating Facility

         Rapid Prototyping

         HMLV (high-mix low-medium-volume)

         Reflow Assembly

         Box Build / Final Assembly

         In-Circuit & Functional Testing

         Placement  of loose components

         ROHS Compliance process capability

EMS

Screen & Stencil Printers : 

Specifications :

  Make : EKRA

  Machine Aliagnment  Capability : � 10 �

  Process  Type : ROHS & NON ROHS

  A large variety of flexible and rigid substrates up to 370 x 450 mm can be printed.

  Flexible screen and stencil holder for all common screen/stencil sizes up to 620 x 740 mm (24 x 29 inches) without additional adapter.

  Motor driven print table with high repeatability.

  All process relevant data can be stored.

  Quickest product changeover.

Pick & Place Machines:

Specifications :

  Make : MYDATA

  On the fly mount order optimization

  Vision autoteach with snap-to-grid

  Automatic illumination settings

  Intelligent feeder concepts-Agilis

  Automatic board stretch compensation

  Automatic conveyor width adjustment

  Intelligent surface impact control

  Can place Chip(from 01005), SOIC, SOT,SOD,TSOP,MELF,CSP,QFP (LOW PROFILE), BGA (LOW PROFILE),DPAK FLIP CHIP

  Max board size is 575x508mm

  Min board size:70x50mm

EMS

EMS

Reflow Machines:

Specifications :

  Make : EMS Technologies

  Optimize reflow profile with system’s five (5) vertical heating zones.

  Each heating zone is independently programmable and easily controlled through the on-board LCD controller.

  Reflow profiling capability with on-board programming and ability to add three (3) thermocouples for specific board locations.

  Maximum flexibility in defining a reflow profile with conveyor speed, heating temperature, convection heat flow, and cooling fans all easily programmed through the system controller.

  Plenum convection heating technology provides uniform temperature profiling across entire PCB board for enhanced SMT process control System’s maximum temperature of 320�C is compatible with most lead and lead-free solder paste profiles.



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